Hamjah, M. K., Steinberger, M., Tam, K. C., Egelhaaf, H. J., Brabec, C. J., Franke, J. 2021 14th International Congress Molded Interconnect Devices (MID) (pp. 1-4). IEEE. Aerosol jet printing…
Reitelshöfer, S., Martin, S., Nendel, F., Schäfer, T., Pham, D., Franke, J. Electroactive Polymer Actuators and Devices (EAPAD) XXII (Vol. 11375, pp. 173-184). SPIE The efficient manufacturing of dielectric layers…
Ankenbrand, M., Scheetz, M., Franke, J., Lomakin, K., Sippel, M., Gold, G., Helmreich, K 2018 13th International Congress Molded Interconnect Devices (MID) (pp. 1-5). IEEE In this work, the aerosol-based…
Reitberger, T., Franke, J., Hoffmann, G. A., Overmeyer, L., Lorenz, L., Wolter, K. J. 2016 12th International Congress Molded Interconnect Devices (MID), Wuerzburg, Germany, 2016, pp. 1-6 As a tribute…
Hoerber, J., Goth, C., Franke, J., Hedges, M. 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, 2011, pp. 813-818 Aerosol-Jet-Printing is an interesting approach to apply circuit tracks on three…
Goth, C., Putzo, S., Franke, J 2011 IEEE 61st electronic components and technology conference (ECTC) (pp. 1211-1216) Printing technologies allow the production of fine pitch electronic applications supporting further miniaturization…
