25. September 2018 Devices Jörg Franke Generation of 3D Functional Structures for High-Frequency Applications by Printing Technologies Ankenbrand, M., Scheetz, M., Franke, J., Lomakin, K., Sippel, M., Gold, G., Helmreich, K 2018 13th International Congress Molded Interconnect Devices (MID) (pp. 1-5). IEEE In this work, the aerosol-based…
